AMD Edge AI.
NPU performance meets FPGA flexibility.
AMD Ryzen AI with XDNA 2 NPU delivers 50+ TOPS for commercial edge AI, while Kria SoM with FPGA fabric enables custom-optimised, deterministic AI for industrial, defence, and aerospace applications.
Two architectures. NPU for commercial, FPGA for industrial.
AMD uniquely offers both x86 + NPU for mainstream edge AI and FPGA-accelerated SoM for deterministic, custom-logic industrial applications.
Ryzen AI 7 PRO 360
- NPU XDNA 2 (50 TOPS)
- GPU RDNA 3.5 iGPU
- Power 15W–28W
- Memory Up to 64GB DDR5
- PRO AMD PRO Security
- SDK ROCm + Vitis AI
Ryzen AI 9 HX 375
- NPU XDNA 2 (55 TOPS)
- GPU RDNA 3.5 iGPU
- Power 28W–54W
- Memory Up to 128GB DDR5
- PRO AMD PRO + Memory Guard
- SDK ROCm + Vitis AI
Kria KR260 / KV260
- Fabric Zynq UltraScale+ FPGA
- Memory 4GB DDR4 + PL DDR
- Power 12W–35W
- I/O GbE, MIPI, HDMI, PMOD
- Temp -40°C to +85°C
- SDK Vitis AI + Vivado
Why AMD for edge AI
XDNA 2 NPU Architecture
50+ TOPS dedicated NPU with INT8/INT4 precision. Runs AI workloads without touching CPU or GPU — all three engines work simultaneously on separate tasks.
FPGA Custom Logic (Kria)
Kria SoM with Zynq UltraScale+ FPGA fabric. Define custom hardware accelerators for specific AI models — sub-microsecond deterministic inference.
ROCm + Vitis AI
Open-source ROCm for GPU compute, Vitis AI for FPGA model optimisation. No proprietary lock-in — community-driven tools with AMD support.
Defence amd-hero Industrial Grade
Extended temperature (-40°C to +85°C on Kria), 10+ year lifecycle support, and AMD PRO security — designed for defence, aerospace, and critical infrastructure.
x86 + NPU Dual Path
Ryzen AI runs existing x86 enterprise apps alongside NPU inference. No code porting — your Windows/Linux stack works with AI acceleration added transparently.
Compact SoM + Carrier
Kria SoM is production-ready out of the box. Pair with RDP carrier boards for custom I/O — fastest time to market for FPGA-based edge AI products.
Where AMD edge AI delivers
Industrial FPGA + AI
EtherCAT/PROFINET bridging in FPGA fabric + AI vision on Arm cores. Deterministic industrial control and AI inspection in a single Kria SoM.
Defence amd-hero Aerospace
Extended temp, MIL-grade reliability, and FPGA customisability for classified applications. RDP provides MII-compliant integration for defence procurement.
Commercial Edge PC
Ryzen AI PRO for enterprise kiosks, VDI, and edge analytics. x86 compatibility with AMD PRO security and NPU acceleration.
Research amd-hero Prototyping
Kria KV260 as an AI research platform for universities and labs. FPGA + Arm + AI — the most flexible research platform available.
RDP integration for AMD platforms
Kria Carrier Board Design
RDP-designed carrier boards for Kria KR260/KV260 with India-specific industrial I/O — RS-485, CAN, DIO, PoE — validated for extended temperature operation.
Ryzen AI Edge PC Enclosures
Compact, fanless or actively-cooled enclosures for Ryzen AI processors. Thermal-validated for 45°C+ ambient with IP54+ dust protection.
Defence amd-hero GeM Compliant
MII-certified for defence procurement. GeM-listed for government. BIS and STQC tested. FPGA-based solutions eligible for strategic projects.
FPGA + AI Integration
RDP provides Vitis AI model deployment support, FPGA bitstream integration, and production programming — bridging hardware design and AI deployment.
Ready to bring AI to the edge?
Tell us your use case, performance requirements, and deployment scale. We’ll recommend the right platform, configure the right Edge PC, and deliver validated hardware — from pilot to production.